Invention Grant
- Patent Title: Methods of distributing an installation program on a wireless link and supporting memory circuit and apparatus
- Patent Title (中): 在无线链路上分发安装程序并支持存储器电路和设备的方法
-
Application No.: US11276111Application Date: 2006-02-14
-
Publication No.: US07672269B2Publication Date: 2010-03-02
- Inventor: Loren J. Rittle , Chen Jia , Nitya Narasimhan , Venugopal Vasudevan
- Applicant: Loren J. Rittle , Chen Jia , Nitya Narasimhan , Venugopal Vasudevan
- Applicant Address: US IL Schaumburg
- Assignee: Motorola, Inc.
- Current Assignee: Motorola, Inc.
- Current Assignee Address: US IL Schaumburg
- Main IPC: H04Q7/00
- IPC: H04Q7/00

Abstract:
A self-contained installation program having at least one payload condition is provided (314) and distributed (316) to a plurality of selected nodes, using a wireless link, that subsequently installs the self-contained program based, at least in part, on a correspondence with the at least one payload condition. Examples of such payload conditions include, but are not limited to, an ability to sense at least one physical property, a deployment role or physical address of the receiving node, a physical location of the receiving node, available node resources, group membership, and so forth.
Public/Granted literature
Information query