Invention Grant
US07672024B2 Contact image sensor module 有权
联系图像传感器模块

  • Patent Title: Contact image sensor module
  • Patent Title (中): 联系图像传感器模块
  • Application No.: US11232938
    Application Date: 2005-09-23
  • Publication No.: US07672024B2
    Publication Date: 2010-03-02
  • Inventor: Chien-Kuo Kuan
  • Applicant: Chien-Kuo Kuan
  • Agency: Workman Nydegger
  • Priority: TW94126985A 20050809
  • Main IPC: H04N1/04
  • IPC: H04N1/04
Contact image sensor module
Abstract:
A contact image sensor module for scanning a document includes a light source, a photosensing array and a lens assembly. The light source emits a light beam to the document, thereby generating an optical signal. The photosensing array is used for converting the optical signal into an electronic signal. The lens assembly is used for focusing the optical signal reflected from the document and imaging the optical signal onto the photosensing array. The photosensing array includes a first photosensing element with a first width and a second photosensing element with a second width. The first width is greater than the second width.
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