Invention Grant
- Patent Title: Substrate and substrate module
- Patent Title (中): 基板和基板模块
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Application No.: US11277563Application Date: 2006-03-27
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Publication No.: US07671709B2Publication Date: 2010-03-02
- Inventor: Takatoshi Yagisawa
- Applicant: Takatoshi Yagisawa
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey, LLP
- Priority: JP2005-352699 20051206
- Main IPC: H01P5/02
- IPC: H01P5/02

Abstract:
A substrate module includes a first substrate and a second substrate. The first substrate comprises a base material; a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material; a ground pattern on the rear surface of the base material; and an exposed portion in which the ground pattern on the substrate surface is exposed by partially cutting out the base material and the ground pattern on the substrate rear surface. The second substrate comprises a base material and a transmission line in which a signal line is sandwiched between two ground patterns, on the surface of the base material. In connecting a transmission line of the first substrate and that of the second substrate, the ground patterns of the first and second substrates are fused with each other at the exposed portion and fixed.
Public/Granted literature
- US20070126524A1 SUBSTRATE AND SUBSTRATE MODULE Public/Granted day:2007-06-07
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