Invention Grant
US07671493B2 Vibration assembly, input device using the vibration assembly, and electronic equipment using the input device
有权
振动组件，使用振动组件的输入装置，以及使用输入装置的电子设备
- Patent Title: Vibration assembly, input device using the vibration assembly, and electronic equipment using the input device
- Patent Title (中): 振动组件，使用振动组件的输入装置，以及使用输入装置的电子设备
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Application No.: US12043262Application Date: 2008-03-06
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Publication No.: US07671493B2Publication Date: 2010-03-02
- Inventor: Kouichiro Takashima , Shun Kayama , Tsutomu Takahashi , Yukiko Shimizu , Hideki Okii , Takashi Sawada
- Applicant: Kouichiro Takashima , Shun Kayama , Tsutomu Takahashi , Yukiko Shimizu , Hideki Okii , Takashi Sawada
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sonnenschein Nath & Rosenthal LLP
- Priority: JP2007-060787 20070309
- Main IPC: H02K35/00
- IPC: H02K35/00
Abstract:
A vibration assembly includes a container, a vibration member containing a hollow portion with a bottom, at least two support members, a magnetic body, a coil having a spool axis, and a diaphragm that is attached to the container. Each of the support members has a flat and corrugated configuration. An end of the one of the support members is bonded to a portion of an edge portion of the hollow portion of the vibration member. The other end of the one of the support members is fixed to a portion of an upper edge of the container. An end of the other support member is bonded to the other portion of the edge portion of the hollow portion of the vibration member. The other end of the other support member is fixed to the other portion of the upper edge of the container.
Public/Granted literature
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