Invention Grant
US07671458B2 Connecting member used for semiconductor device including plurality of arranged semiconductor modules and semiconductor device provided with the same
有权
用于包括多个布置的半导体模块的半导体器件的连接部件和具有该连接部件的半导体器件
- Patent Title: Connecting member used for semiconductor device including plurality of arranged semiconductor modules and semiconductor device provided with the same
- Patent Title (中): 用于包括多个布置的半导体模块的半导体器件的连接部件和具有该连接部件的半导体器件
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Application No.: US11367272Application Date: 2006-03-06
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Publication No.: US07671458B2Publication Date: 2010-03-02
- Inventor: Norifumi Furuta , Noriyuki Masuda
- Applicant: Norifumi Furuta , Noriyuki Masuda
- Applicant Address: JP Toyota
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota
- Agency: Oliff & Berridge, PLC.
- Priority: JP2005-091973 20050328
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A connector includes a fitting hole into which a signal line is fitted, a tapered portion formed to lead a tip portion of the signal line to the fitting hole, and a bonded portion for bonding the connector to a control substrate. The tapered portion has a tapered shape on a side where the signal line is inserted. The tapered shape is tilted from a peripheral portion of the tapered portion to the fitting hole in a direction along which the signal line is inserted, with the fitting hole set as a center.
Public/Granted literature
Information query
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