Invention Grant
US07671361B2 Semiconductor device including fuse focus detector, fabricating method thereof and laser repair method using the fuse focus detector
有权
包括保险丝聚焦检测器,其制造方法和使用熔丝焦点检测器的激光修复方法的半导体器件
- Patent Title: Semiconductor device including fuse focus detector, fabricating method thereof and laser repair method using the fuse focus detector
- Patent Title (中): 包括保险丝聚焦检测器,其制造方法和使用熔丝焦点检测器的激光修复方法的半导体器件
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Application No.: US11434144Application Date: 2006-05-16
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Publication No.: US07671361B2Publication Date: 2010-03-02
- Inventor: Kwang-kyu Bang , Yong-won Lee , Kyeong-seon Shin , Hyen-wook Ju , Jeong-kyu Kim
- Applicant: Kwang-kyu Bang , Yong-won Lee , Kyeong-seon Shin , Hyen-wook Ju , Jeong-kyu Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2005-0116641 20051201
- Main IPC: H01L23/58
- IPC: H01L23/58

Abstract:
Provided are a semiconductor device including a fuse focus detector, a fabrication method thereof and a laser repair method. In a chip region, fuses may be formed at a first level. A fuse focus detector including first and second conductive layers may be formed in a scribe line region. The first conductive layer may be formed at the first level, while the second conductive layer may be formed at a different level. For a laser repair method, a target region may be divided into sub-regions. In one selected sub-region, the fuse focus detector may be laser scanned in a direction for a reflection light measurement providing information on a thickness of the fuse focus detector. Using the thickness information, a focus offset value of a fuse in the selected sub-region may be calculated. When the focus offset value is within an allowable range, fuse cutting may be performed.
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