Invention Grant
US07671353B2 Integrated circuit having contact including material between sidewalls
失效
具有接触的集成电路，包括侧壁之间的材料
- Patent Title: Integrated circuit having contact including material between sidewalls
- Patent Title (中): 具有接触的集成电路，包括侧壁之间的材料
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Application No.: US11757712Application Date: 2007-06-04
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Publication No.: US07671353B2Publication Date: 2010-03-02
- Inventor: Jan Boris Philipp , Thomas Happ
- Applicant: Jan Boris Philipp , Thomas Happ
- Applicant Address: US NC Cary
- Assignee: Qimonda North America Corp.
- Current Assignee: Qimonda North America Corp.
- Current Assignee Address: US NC Cary
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L47/00
- IPC: H01L47/00
Abstract:
An integrated circuit includes a bottom electrode, a top electrode, resistivity changing material between the bottom electrode and the top electrode, and a contact contacting the top electrode. The contact includes a bottom and sidewalls. The integrated circuit includes first material between the sidewalls of the contact.
Public/Granted literature
- US20080296553A1 INTEGRATED CIRCUIT HAVING CONTACT INCLUDING MATERIAL BETWEEN SIDEWALLS Public/Granted day:2008-12-04
Information query
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