Invention Grant
US07671146B2 Epoxy resin composition for encapsulating semiconductor and semiconductor device
失效
用于封装半导体和半导体器件的环氧树脂组合物
- Patent Title: Epoxy resin composition for encapsulating semiconductor and semiconductor device
- Patent Title (中): 用于封装半导体和半导体器件的环氧树脂组合物
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Application No.: US11713598Application Date: 2007-03-05
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Publication No.: US07671146B2Publication Date: 2010-03-02
- Inventor: Ken Ukawa , Hirofumi Kuroda
- Applicant: Ken Ukawa , Hirofumi Kuroda
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Company, Ltd
- Current Assignee: Sumitomo Bakelite Company, Ltd
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2006-061934 20060307; JP2006-345051 20061221
- Main IPC: C08G59/14
- IPC: C08G59/14
Abstract:
This invention provides an epoxy resin composition for encapsulating a semiconductor exhibiting higher flame resistance, good flowability and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant, as well as a highly reliable semiconductor device in which a semiconductor element is encapsulated with a cured product from the composition.
Public/Granted literature
- US20070213477A1 Epoxy resin composition for encapsulating semiconductor and semiconductor device Public/Granted day:2007-09-13
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