Invention Grant
US07671114B2 Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder
有权
取代环氧乙烷或氧杂环丁烷化合物与银基，无铅焊料的粘合剂
- Patent Title: Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder
- Patent Title (中): 取代环氧乙烷或氧杂环丁烷化合物与银基，无铅焊料的粘合剂
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Application No.: US12176729Application Date: 2008-07-21
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Publication No.: US07671114B2Publication Date: 2010-03-02
- Inventor: John G. Woods , Yuhshi Lu , Bruce C. B. Chan , Philip T. Klemarczyk , Andrew D. Messana
- Applicant: John G. Woods , Yuhshi Lu , Bruce C. B. Chan , Philip T. Klemarczyk , Andrew D. Messana
- Applicant Address: US CT Rocky Hill
- Assignee: Henkel Corporation
- Current Assignee: Henkel Corporation
- Current Assignee Address: US CT Rocky Hill
- Agent Steven C. Bauman
- Main IPC: C08K3/08
- IPC: C08K3/08 ; C08L63/00 ; C08L71/00
Abstract:
In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
Public/Granted literature
- US20090018239A1 UNDERFILL ADHESIVES Public/Granted day:2009-01-15
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