Invention Grant
- Patent Title: Plated pillar package formation
- Patent Title (中): 电镀柱包装形成
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Application No.: US11675731Application Date: 2007-02-16
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Publication No.: US07670874B2Publication Date: 2010-03-02
- Inventor: John Trezza
- Applicant: John Trezza
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method involves plating pillars of electrically conductive material up from a seed layer located on a substrate, surrounding the pillars with a fill material so that the pillars and fill material collectively define a first package, and removing the substrate from the first package.
Public/Granted literature
- US20080197508A1 PLATED PILLAR PACKAGE FORMATION Public/Granted day:2008-08-21
Information query
IPC分类:
