Invention Grant
US07670749B2 Resist material and method for forming a patterned resist layer on a substrate
失效
用于在衬底上形成图案化抗蚀剂层的抗蚀材料和方法
- Patent Title: Resist material and method for forming a patterned resist layer on a substrate
- Patent Title (中): 用于在衬底上形成图案化抗蚀剂层的抗蚀材料和方法
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Application No.: US11663017Application Date: 2005-09-19
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Publication No.: US07670749B2Publication Date: 2010-03-02
- Inventor: Richard Edward Palmer , Alex Robinson , Jon Andrew Preece
- Applicant: Richard Edward Palmer , Alex Robinson , Jon Andrew Preece
- Applicant Address: GB Birmingham
- Assignee: The University of Birmingham
- Current Assignee: The University of Birmingham
- Current Assignee Address: GB Birmingham
- Agency: Ohlandt, Greeley, Ruggiero & Perle, L.L.P.
- Priority: GB0420704.9 20040917
- International Application: PCT/GB2005/003605 WO 20050919
- International Announcement: WO2006/030239 WO 20060323
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/30

Abstract:
A method for the formation of a patterned resist layer on a substrate surface by patternwise irradiation with actinic radiation. The first step of the method is formation of a coating layer comprising a substituted triphenylene compound having a diameter of between 1 and 3 nm, a sensitizer which increases the sensitivity of the exposed layer to the actinic radiation used in a subsequent irradiation step and a cross-linker on the substrate surface. Subsequently the coating layer is irradiated patternwise, and unirradiated areas of the coating layer are removed. A resist material comprising a solution of: (i) as the principal resist material a triphenylene derivative having a diameter of from 1 to 3 rim, (ii) a sensitizer which increases the sensitivity of the resist material to actinic radiation, and (iii) a cross-linker capable of cross-linking molecules of the triphenyl derivative, the cross-linker optionally being constituted by a moiety attached to the triphenylene derivative.
Public/Granted literature
- US20070298328A1 Novel Resist Material and Method for Forming a Patterned Resist Layer on a Substrate Public/Granted day:2007-12-27
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