Invention Grant
- Patent Title: Method and system for double-sided patterning of substrates
- Patent Title (中): 用于基板双面图案化的方法和系统
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Application No.: US11565350Application Date: 2006-11-30
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Publication No.: US07670529B2Publication Date: 2010-03-02
- Inventor: Byung-Jin Choi , Sidlgata V. Sreenivasan
- Applicant: Byung-Jin Choi , Sidlgata V. Sreenivasan
- Applicant Address: US TX Austin
- Assignee: Molecular Imprints, Inc.
- Current Assignee: Molecular Imprints, Inc.
- Current Assignee Address: US TX Austin
- Agent Laura C. Robinson
- Main IPC: B29C35/02
- IPC: B29C35/02
Abstract:
The present invention is directed towards a method and a system of patterning first and second opposed sides of a substrate. The method and system may employ a mold assembly and obtaining a desired spatial relationship between the first and second opposed sides of the substrate and the mold assembly. In a further embodiment, the method and system may employ a first and a second mold assembly.
Public/Granted literature
- US20070132152A1 Method and System for Double-Sided Patterning of Substrates Public/Granted day:2007-06-14
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