Invention Grant
- Patent Title: Mask and substrate alignment for solder bump process
- Patent Title (中): 焊料凸块工艺的掩模和衬底对准
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Application No.: US12117061Application Date: 2008-05-08
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Publication No.: US07670437B2Publication Date: 2010-03-02
- Inventor: Duane E. Allen , Brian K. Burnor , Thomas A. Dotolo , Leonard J. Gardecki , William L. Hammond , Kibby B. Horsford , Charles R. Ramsey
- Applicant: Duane E. Allen , Brian K. Burnor , Thomas A. Dotolo , Leonard J. Gardecki , William L. Hammond , Kibby B. Horsford , Charles R. Ramsey
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olsen & Watts
- Agent Richard M. Kotulak
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306

Abstract:
A system for of aligning a mask to a substrate comprising: a fixture for holding the mask and the substrate in fixed positions relative to each other; means for holding the substrate, the means for holding the substrate protruding through openings in a table and the fixture, the means for holding fixedly mounted on a stage, the stage moveable in first and second directions and rotatable about an axis relative to the table; means for affixing the fixture containing the mask and the substrate to the table; means for controlling the means for temporarily affixing so as to generate a uniform force around a perimeter of the fixture to effectuate the temporarily affixing; means for aligning the mask to the substrate, the means for aligning controlling movement of the stage in the first and second directions and rotation about the axis; and means for fastening the fixture together.
Public/Granted literature
- US20080202421A1 MASK AND SUBSTRATE ALIGNMENT FOR SOLDER BUMP PROCESS Public/Granted day:2008-08-28
Information query
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