Invention Grant
- Patent Title: Support ring assembly
- Patent Title (中): 支撑环组件
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Application No.: US10981261Application Date: 2004-11-03
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Publication No.: US07670436B2Publication Date: 2010-03-02
- Inventor: Keith A. Miller , Ilya Lavitsky
- Applicant: Keith A. Miller , Ilya Lavitsky
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Janah & Associates, P.C.
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306
Abstract:
A substrate ring assembly is provided for a substrate support having a peripheral edge. The assembly has an annular band having an inner perimeter that surrounds and at least partially covers the peripheral edge of the substrate support. The assembly also has a clamp to secure the annular band to the peripheral edge of the substrate support.
Public/Granted literature
- US20060090706A1 Support ring assembly Public/Granted day:2006-05-04
Information query
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