Invention Grant
- Patent Title: Laminated and bonded structure of plates
- Patent Title (中): 板材的层压和结合结构
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Application No.: US11122296Application Date: 2005-05-04
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Publication No.: US07669982B2Publication Date: 2010-03-02
- Inventor: Atsushi Ito
- Applicant: Atsushi Ito
- Applicant Address: JP Nagoya-Shi
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Nagoya-Shi
- Agency: Reed Smith LLP
- Priority: JPP2004-138453 20040507
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/05

Abstract:
A laminated and bonded structure includes plural plates. The plates include first and second plates. The plates are laminated and bonded to each other with an adhesive agent. The first and second plates have laminated surfaces bonded to each other. A first escape groove is defined in the laminated surface of at least one of the first and second plates. The first escape groove guides the adhesive agent along the laminated surface. The first escape groove includes an outlet portion in an outer peripheral side surface of the at least one of the first and second plates. The outer peripheral side surface intersects with the laminated surfaces. One of the first and second plates defines a recessed first reservoir portion being capable of accumulating the adhesive agent passing through the first escape groove. The first reservoir portion communicates with the first escape groove.
Public/Granted literature
- US20060024477A1 Laminated and bonded structure of plates Public/Granted day:2006-02-02
Information query
IPC分类: