Invention Grant
- Patent Title: Inkjet printhead packaging tape for sealing nozzles
- Patent Title (中): 用于密封喷嘴的喷墨打印头包装胶带
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Application No.: US11699295Application Date: 2007-01-29
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Publication No.: US07669978B2Publication Date: 2010-03-02
- Inventor: Paul T. Spivey , William B. Rose
- Applicant: Paul T. Spivey , William B. Rose
- Applicant Address: US KY Lexington
- Assignee: Lexmark International, Inc.
- Current Assignee: Lexmark International, Inc.
- Current Assignee Address: US KY Lexington
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14 ; B41J2/16 ; B41J2/175

Abstract:
An inkjet printhead has a body and a heater chip attached thereto. A nozzle plate on the heater chip includes a periphery and plurality of nozzle holes. An encapsulant bead lines the periphery of the nozzle plate and has a leading edge extending in a direction away from the periphery toward the plurality of nozzle holes. The boundary of the bead embodies an irregular shape and the leading edge exists less than about 500 microns from any of the nozzle holes. A tape attaches to the nozzle plate and covers each of the nozzle holes. The tape does not, however, touch the encapsulant bead. Preferably, the tape has a narrow width portion shorter than a width of the nozzle plate. In this manner, the encapsulant bead may encroach upon the nozzle holes closer than heretofore known. In turn, the heater chip can have reduced size and silicon savings.
Public/Granted literature
- US20070120890A1 Inkjet printhead packaging tape for sealing nozzles Public/Granted day:2007-05-31
Information query
IPC分类: