Invention Grant
- Patent Title: Boarding ramp device for aircraft
- Patent Title (中): 飞机登机坡道装置
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Application No.: US11730732Application Date: 2007-04-03
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Publication No.: US07669797B2Publication Date: 2010-03-02
- Inventor: Wataru Yada , Hiroshi Yamanouchi
- Applicant: Wataru Yada , Hiroshi Yamanouchi
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-103268 20060404
- Main IPC: B64C1/14
- IPC: B64C1/14

Abstract:
A foldable boarding ramp is operatively connected to a door opening provided in a body and is selectively extendable to the ground. The foldable boarding ramp is stored in a folded state inside a fairing covering a connecting portion between the body and a main wing. Thus, a reduction in the space of a passenger compartment and a cargo compartment due to the storage of the folded boarding ramp is prevented. In addition, an increase in air resistance can be suppressed without providing a dedicated fairing for covering the boarding ramp. Further, an interlocking member connects together a door for opening and closing the door opening and the boarding ramp when the door is opened. The boarding ramp may be automatically deployed to improve convenience.
Public/Granted literature
- US20070283512A1 Boarding ramp device for aircraft Public/Granted day:2007-12-13
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