Invention Grant
- Patent Title: Modular thermoelectric chilling system
- Patent Title (中): 模块化热电冷冻系统
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Application No.: US11734287Application Date: 2007-04-12
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Publication No.: US07669435B2Publication Date: 2010-03-02
- Inventor: Anand Ganesh Joshi
- Applicant: Anand Ganesh Joshi
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Penny A. Clarke
- Main IPC: F25D11/02
- IPC: F25D11/02 ; F25B21/02

Abstract:
In an aspect of the invention, an apparatus for providing chilling in a localized area comprises a chiller compartment and an independent cooling source thermally coupled to the chiller compartment by a thermally conductive interface. The cooling source provides a separate controllable temperature to the chiller compartment, which is adapted to be removably positioned in a selected temperature controlled environment. In another aspect a refrigerator comprises a freezer unit, a fresh food unit and a chiller compartment adapted to be removably positioned in either the freezer unit or the fresh food unit as a secondary chilling compartment. In another aspect a method of chilling comprises cooling a modular chiller compartment using an independent cooling source, chiller compartment being removably positioned within a temperature controlled environment and the cooling source and the chiller compartment being thermally coupled.
Public/Granted literature
- US20070175224A1 MODULAR THERMOELECTRIC CHILLING SYSTEM Public/Granted day:2007-08-02
Information query
IPC分类: