Invention Grant
- Patent Title: Two-way postal mailing assembly
- Patent Title (中): 双向邮寄邮件
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Application No.: US11160496Application Date: 2005-06-27
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Publication No.: US07669389B2Publication Date: 2010-03-02
- Inventor: Todd N Butler
- Applicant: Todd N Butler
- Applicant Address: US OH Hamilton
- Assignee: Butler Leasing Corporation
- Current Assignee: Butler Leasing Corporation
- Current Assignee Address: US OH Hamilton
- Agency: Wood, Herron & Evans, LLP
- Main IPC: B65B11/48
- IPC: B65B11/48

Abstract:
Postal mailing assembly capable of being processed by postal processing equipment without causing damage to the article held by the mailer. The mailing assembly includes a pocket holding the article inside the mailer is offset relative to one edge of the assembly by a distance sufficient to prevent damage when the mailer is oriented and processed by postal equipment.
Public/Granted literature
- US20050224566A1 TWO-WAY POSTAL MAILING ASSEMBLY Public/Granted day:2005-10-13
Information query
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