Invention Grant
- Patent Title: Process for mounting parts to cable
- Patent Title (中): 将零件安装到电缆的工艺
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Application No.: US10625851Application Date: 2003-07-24
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Publication No.: US07669322B2Publication Date: 2010-03-02
- Inventor: Toshiyuki Hosokawa
- Applicant: Toshiyuki Hosokawa
- Applicant Address: JP Miyazaki
- Assignee: Kabushiki Kaisha Honda Lock
- Current Assignee: Kabushiki Kaisha Honda Lock
- Current Assignee Address: JP Miyazaki
- Agency: Arent Fox LLP
- Priority: JP2002-216708 20020725
- Main IPC: H01R43/00
- IPC: H01R43/00

Abstract:
In a process for mounting a plurality of parts to a cable in mounted positions and in mounted attitudes determined respectively for the parts, information for the mounting of each of parts is marked on the cable before mounting of the parts. Thus, the mounting of the parts can be carried out without selection of a worker, leading to an improved general-purpose property. Also, an exclusive jig is not required, resulting in a reduced cost and elimination of need to secure a space for storing the jig.
Public/Granted literature
- US20040063359A1 Process for mounting parts to cable Public/Granted day:2004-04-01
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