Invention Grant
- Patent Title: Method and system for analyzing a plurality of parts
- Patent Title (中): 用于分析多个部件的方法和系统
-
Application No.: US10328071Application Date: 2002-12-23
-
Publication No.: US07657455B2Publication Date: 2010-02-02
- Inventor: Sunit K. Sachdev , Nelson A. Jones , Syamala Srinivasan
- Applicant: Sunit K. Sachdev , Nelson A. Jones , Syamala Srinivasan
- Applicant Address: US IL Rosemont
- Assignee: Akoya, Inc.
- Current Assignee: Akoya, Inc.
- Current Assignee Address: US IL Rosemont
- Agency: Reed Smith, LLP
- Main IPC: G06F17/60
- IPC: G06F17/60
Abstract:
The present invention includes a method and system configured to analyze a plurality of parts, each of the parts having at least one part characteristic. The method includes the steps of establishing at least one repository of the part characteristics, establishing a relationship between at least a portion of the parts and a cost characteristic; and, analyzing the portion of the parts in response to the relationship.
Public/Granted literature
- US20040122860A1 Method and system for analyzing a plurality of parts Public/Granted day:2004-06-24
Information query
