Invention Grant
- Patent Title: Optoelectric printed circuit board, method of manufacturing the same, and optoelectric transmission method using the optoelectric printed circuit board
- Patent Title (中): 光电印刷电路板，其制造方法和使用光电印刷电路板的光电传输方法
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Application No.: US11677087Application Date: 2007-02-21
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Publication No.: US07657144B2Publication Date: 2010-02-02
- Inventor: Myung Hyun Lee , Suntak Park , Jung Jin Ju , Min Su Kim , Seung Koo Park
- Applicant: Myung Hyun Lee , Suntak Park , Jung Jin Ju , Min Su Kim , Seung Koo Park
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Ladas & Parry LLP
- Priority: KR10-2006-0016664 20060221
- Main IPC: G02B6/10
- IPC: G02B6/10
Abstract:
Provided are an optoelectric printed circuit board (PCB) including an optoelectric transmission metal track and a dielectric layer, an optoelectric transmission method using the optoelectric PCB, and a method of manufacturing the optoelectric PCB. The optoelectric transmission method includes injecting light and electricity to the optoelectric PCB including at least one optoelectric transmission metal track and a dielectric layer contacting the optoelectric transmission metal track. The injected light and electricity are transmitted through the optoelectric PCB. The transmitted light and electricity are emitted from the optoelectric PCB.
Public/Granted literature
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