Invention Grant
US07657046B2 IC chip type hearing aid module for mobile communication terminal
有权
用于移动通信终端的IC芯片型助听器模块
- Patent Title: IC chip type hearing aid module for mobile communication terminal
- Patent Title (中): 用于移动通信终端的IC芯片型助听器模块
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Application No.: US11301841Application Date: 2005-12-12
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Publication No.: US07657046B2Publication Date: 2010-02-02
- Inventor: Book-sung Park
- Applicant: Book-sung Park
- Applicant Address: KR Seoul
- Assignee: Pantech & Curitel Communications, Inc.
- Current Assignee: Pantech & Curitel Communications, Inc.
- Current Assignee Address: KR Seoul
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2005-0016126 20050225
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
Disclosed is an IC chip type hearing aid module for use in a mobile communication terminal having a hearing aid circuit including: a first section having a resistor R1 and an inductor L1 which are connected in series on a first output line Receiver_P between the mobile communication terminal and an ear speaker; a second section having a resistor R4 and an inductor L2 which are connected in series on a second output line Receiver_N between the mobile communication terminal and the ear speaker; a third section having a resistor R2 and a capacitor C2 which are connected in series between an input terminal of the first section and an output terminal of the second section; and a fourth section having a resistor R3 and a capacitor C3 which are connected in series between an input terminal of the second section and an output terminal of the first section.
Public/Granted literature
- US20060193485A1 IC chip type hearing aid module for mobile communication terminal Public/Granted day:2006-08-31
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