Invention Grant
- Patent Title: Semiconductor light emitting device and method for fabricating same
- Patent Title (中): 半导体发光器件及其制造方法
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Application No.: US12000929Application Date: 2007-12-19
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Publication No.: US07656916B2Publication Date: 2010-02-02
- Inventor: Kunihiro Takatani , Daisuke Hanaoka , Masaya Ishida
- Applicant: Kunihiro Takatani , Daisuke Hanaoka , Masaya Ishida
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2006-346520 20061222
- Main IPC: H01S3/04
- IPC: H01S3/04

Abstract:
A nitride semiconductor device includes a stem. A heat sink is provided on the stem. At least one nitride semiconductor light-emitting element is connected to the heat sink. A light-detecting element for detecting light from the semiconductor light-emitting element is provided on the stem. A cap for encapsulating therein the heat sink, the semiconductor light-emitting element, and the light-detecting element in a sealed manner is connected to the stem. The space in the cap has an encapsulated atmosphere. The encapsulated atmosphere contains a component for inhibiting diffusion of hydrogen atoms contained in the semiconductor light-emitting element. The present invention suppresses defect due to an increase in operation voltage to increase a ratio of good goods thereby improving the fabrication yield of the semiconductor light-emitting device.
Public/Granted literature
- US20080151952A1 Semiconductor light emitting device and method for fabricating same Public/Granted day:2008-06-26
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