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US07656650B2 Modular printed board assembly, plasma display apparatus having the same, and method of fabricating the assembly 失效
模块化印刷电路板组件，等离子体显示装置及其制造方法

  • Patent Title: Modular printed board assembly, plasma display apparatus having the same, and method of fabricating the assembly
  • Patent Title (中): 模块化印刷电路板组件，等离子体显示装置及其制造方法
  • Application No.: US11207884
    Application Date: 2005-08-22
  • Publication No.: US07656650B2
    Publication Date: 2010-02-02
  • Inventor: Yeung-Ki Kim
  • Applicant: Yeung-Ki Kim
  • Applicant Address: KR Maetan-dong, Yeongtong-gu, Suwon-si, Gyeonggi-do
  • Assignee: Samsung SDI Co., Ltd.
  • Current Assignee: Samsung SDI Co., Ltd.
  • Current Assignee Address: KR Maetan-dong, Yeongtong-gu, Suwon-si, Gyeonggi-do
  • Agent Robert E. Bushnell, Esq.
  • Priority: KR10-2004-0081756 20041013
  • Main IPC: G06F1/16
  • IPC: G06F1/16
Modular printed board assembly, plasma display apparatus having the same, and method of fabricating the assembly
Abstract:
In a modular printed board assembly, a plasma display apparatus including the modular printed board assembly, and a method of fabricating the modular printed board assembly, the modular printed board includes: a frame of plate shape fixed on a chassis base; and a plurality of printed board assemblies, on which a plurality of electronic elements are mounted, installed on the frame.
Abstract(Chinese):

在模块化印刷电路板组件中，包括模块化印刷电路板组件的等离子体显示装置和制造模块化印刷电路板组件的方法，所述模块化印刷电路板包括：固定在底架上的板状框架; 以及安装有多个电子元件的多个印刷电路板组件。

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