Invention Grant
- Patent Title: Magnetic head device provided with lead electrode electrically connected to magnetic shield layer
- Patent Title (中): 磁头装置设置有电连接到磁屏蔽层的引线电极
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Application No.: US11567562Application Date: 2006-12-06
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Publication No.: US07656620B2Publication Date: 2010-02-02
- Inventor: Yoshihiro Nishiyama , Yasuo Hayakawa , Daigo Aoki
- Applicant: Yoshihiro Nishiyama , Yasuo Hayakawa , Daigo Aoki
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Brinks Hofer Gilson & Lione
- Priority: JP2005-351727 20051206
- Main IPC: G11B5/11
- IPC: G11B5/11 ; G11B5/39

Abstract:
A lower shield layer has a substantially flat shape, and an upper shield layer has a front portion and a rear portion, where the front portion is disposed closer to the lower shield layer than the rear portion. A lower conductive electrode and an upper conductive electrode are disposed between the lower shield layer and the upper shield layer. The lower conductive electrode is electrically connected to the lower shield layer, and the upper conductive electrode is electrically connected to the upper shield layer. Since the lower and upper conductive electrodes are disposed between the upper and lower shield layers, each of the lower shield layer and the upper shield layer may be formed to have a small area and a simple shape.
Public/Granted literature
- US20070127157A1 MAGNETIC HEAD DEVICE PROVIDED WITH LEAD ELECTRODE ELECTRICALLY CONNECTED TO MAGNETIC SHIELD LAYER Public/Granted day:2007-06-07
Information query
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