Invention Grant
- Patent Title: Pixel structure and manufacturing method thereof
- Patent Title (中): 像素结构及其制造方法
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Application No.: US11767484Application Date: 2007-06-23
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Publication No.: US07656479B2Publication Date: 2010-02-02
- Inventor: Hsiang-Lin Lin , Ching-Huan Lin , Te-Chun Huang
- Applicant: Hsiang-Lin Lin , Ching-Huan Lin , Te-Chun Huang
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW96109699A 20070321
- Main IPC: G02F1/1333
- IPC: G02F1/1333

Abstract:
A pixel structure disposed on a substrate includes a gate, a patterned dielectric layer, a patterned semiconductor layer, a patterned metal layer, an overcoat layer and a transparent pixel electrode. The patterned dielectric layer and the gate covered thereby are disposed on the substrate. The patterned semiconductor layer on the patterned dielectric layer includes bumps and a channel above the gate. The patterned metal layer includes a source, a drain and a reflective pixel electrode connecting the drain. The source and the drain cover a portion of the channel. The reflective pixel electrode covers the bumps. The gate, the patterned dielectric layer, the patterned semiconductor layer and the patterned metal layer form a transistor on which the overcoat layer has a contact hole exposing a portion of the reflective pixel electrode. The transparent pixel electrode on the overcoat layer electrically connects the reflective pixel electrode through the contact hole.
Public/Granted literature
- US20080231782A1 PIXEL STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2008-09-25
Information query
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