Invention Grant
- Patent Title: Three-dimensional microstructures having an embedded support member with an aperture therein and method of formation thereof
- Patent Title (中): 三维微结构具有嵌入的支撑构件和孔的形成方法
-
Application No.: US12005936Application Date: 2007-12-28
-
Publication No.: US07656256B2Publication Date: 2010-02-02
- Inventor: William D. Houck , David W. Sherrer
- Applicant: William D. Houck , David W. Sherrer
- Applicant Address: US VA Radford
- Assignee: Nuvotronics, PLLC
- Current Assignee: Nuvotronics, PLLC
- Current Assignee Address: US VA Radford
- Agency: Sherr & Vaughn, PLLC
- Main IPC: H01P3/06
- IPC: H01P3/06
Abstract:
Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
Public/Granted literature
- US20080197946A1 Three-dimensional microstructures and methods of formation thereof Public/Granted day:2008-08-21
Information query
