Invention Grant
- Patent Title: Integrated circuit with improved component interconnections
- Patent Title (中): 具有改进的组件互连的集成电路
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Application No.: US11525113Application Date: 2006-09-21
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Publication No.: US07656037B2Publication Date: 2010-02-02
- Inventor: Martina Hommel , Heinrich Koerner , Markus Schwerd , Martin Seck
- Applicant: Martina Hommel , Heinrich Koerner , Markus Schwerd , Martin Seck
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Brinks Hofer Gilson & Lione
- Priority: DE102005045059 20050921
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S3/13 ; H01L23/52 ; H01L23/522 ; H01L27/08 ; H01L23/64
Abstract:
An integrated circuit arrangement is disclosed. In one embodiment, the integrated circuit arrangement includes at least three conductive structures levels and elongated interconnects.
Public/Granted literature
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