Invention Grant
US07656033B2 Semiconductor device with a semiconductor chip using lead technology and method of manufacturing the same
有权
具有使用引线技术的半导体芯片的半导体器件及其制造方法
- Patent Title: Semiconductor device with a semiconductor chip using lead technology and method of manufacturing the same
- Patent Title (中): 具有使用引线技术的半导体芯片的半导体器件及其制造方法
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Application No.: US11678960Application Date: 2007-02-26
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Publication No.: US07656033B2Publication Date: 2010-02-02
- Inventor: Alexander Koenigsberger , Klaus Schiess
- Applicant: Alexander Koenigsberger , Klaus Schiess
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: DE102004041088 20040824
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A semiconductor device using lead technology includes a semiconductor chip with external side electrodes of semiconductor components disposed on its top side. On its rear side, the semiconductor chip is connected to a rear side internal lead adapted to the rear side of semiconductor chip. On its top side, the semiconductor chip is connected a plurality of top side internal leads. The top side internal leads are electrically connected to external leads of the semiconductor device.
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