Invention Grant
- Patent Title: Chip module for complete power train
- Patent Title (中): 完整动力传动系统的芯片模块
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Application No.: US11427906Application Date: 2006-06-30
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Publication No.: US07656024B2Publication Date: 2010-02-02
- Inventor: Alan Elbanhawy , Benny Tjia
- Applicant: Alan Elbanhawy , Benny Tjia
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L29/00 ; H01L23/34
Abstract:
A chip module is disclosed. It includes a circuit substrate, a semiconductor die comprising a power transistor mounted on the circuit substrate, and a passive electronic component. The passive electronic component is in electrical communication with the semiconductor die, and is in thermal communication with the semiconductor die.
Public/Granted literature
- US20080001279A1 CHIP MODULE FOR COMPLETE POWER TRAIN Public/Granted day:2008-01-03
Information query
IPC分类:
