An integrated circuit package system includes providing a substrate having a bond finger thereon and forming a pedestal on a portion of the bond finger. A first die is mounted on the substrate and adjacent to the bond finger. A portion of the first die, a portion of the bond finger, and a portion of the pedestal are embedded in an resin layer with an exposed portion of the pedestal protruding from the resin layer. A second die is mounted on the first die and electrically coupled to the exposed portion of the pedestal.