When a heating plate performs heat treatment on a substrate by a wireless wafer provided with a temperature detecting portion, a storing portion and a controller, the temperature of the heating plate is measured readily and accurately while suppressing lowering of a heating operation efficiency due to a measuring operation. A temperature measurement start instruction is provided to the controller of the wireless wafer at a position in a wireless wafer carrier, and thereby the wireless wafer starts temperature detection to store time-series data of the detected temperature value in the storing portion. The wireless wafer is transferred to a heating unit through a predetermined transfer path. Based on a transportation time required for placing the wireless wafer on the heating plate and the time-series data of the detected temperature value in the storing portion, the time-series data of the detected temperature value obtained after the wireless wafer is placed on the heating plate is fetched.