Invention Grant
- Patent Title: Method of cleaning semiconductor surfaces
- Patent Title (中): 半导体表面的清洁方法
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Application No.: US11605065Application Date: 2006-11-28
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Publication No.: US07655095B2Publication Date: 2010-02-02
- Inventor: Paul A. Farrar
- Applicant: Paul A. Farrar
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: B08B7/00
- IPC: B08B7/00

Abstract:
Devices and methods of cleaning are described. The methods, and devices formed by the methods have a number of advantages. Embodiments are shown that include cleaning using a supercritical fluid. Advantages include a combination of both chemical and mechanical removal abilities from the supercritical fluid. Mechanical energy for cleaning is transmitted in a homogenous manner throughout a carrier fluid. The mechanical energy provided in methods shown can also be used with delicate surface features.
Public/Granted literature
- US20070072368A1 Method of cleaning semiconductor surfaces Public/Granted day:2007-03-29
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