Invention Grant
- Patent Title: Polishing composition and polishing method
- Patent Title (中): 抛光组合物和抛光方法
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Application No.: US11512997Application Date: 2006-08-30
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Publication No.: US07655057B2Publication Date: 2010-02-02
- Inventor: Eiichi Yamada
- Applicant: Eiichi Yamada
- Applicant Address: JP Kiyosu-shi, Aichi
- Assignee: Fujimi Incorporated
- Current Assignee: Fujimi Incorporated
- Current Assignee Address: JP Kiyosu-shi, Aichi
- Agency: Vidas, Arrett & Steinkraus
- Priority: JP2005-252638 20050831; JP2005-252639 20050831; JP2005-252640 20050831
- Main IPC: C09K3/14
- IPC: C09K3/14 ; B24D3/02 ; C09C1/68

Abstract:
A polishing composition contains a compound represented by the general formula (1) below and abrasive grains. In the general formula (1), X represents a residue of polyether polyol (having a polyether chain containing an oxyethylene group in an amount of 20 to 90% by mass) derived from a compound having an active hydrogen atom and an alkylene oxide; m represents an integer of 2 to 8, which is equal to the number of hydroxy groups contained in a single polyether polyol molecule; Y and Z represent a lower alcohol residue to which ethylene oxide or propylene oxide is added by addition polymerization, an alkyl group or an alkylene group, respectively; and n is an integer of 3 or more.
Public/Granted literature
- US20070044385A1 Polishing composition and polishing method Public/Granted day:2007-03-01
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