Invention Grant
- Patent Title: Vacuum chuck and suction board
- Patent Title (中): 真空吸盘
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Application No.: US11525820Application Date: 2006-09-25
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Publication No.: US07654887B2Publication Date: 2010-02-02
- Inventor: Shigeharu Ishikawa , Katsuyuki Kiriyama
- Applicant: Shigeharu Ishikawa , Katsuyuki Kiriyama
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-090105 20040325; JP2004-093573 20040326; JP2004-093574 20040326; JP2004-093575 20040326
- Main IPC: B24B47/00
- IPC: B24B47/00
Abstract:
The vacuum chuck according to the present invention is provided with a sucking plate for sucking and holding an object to be sucked, in which a sucking layer made of a porous ceramic and a dense material layer are integrated, the sucking layer being located on the side for sucking the object to be sucked, wherein the dense material layer is formed by impregnating the porous ceramic with a metal.
Public/Granted literature
- US20070063453A1 Vacuum chuck and suction board Public/Granted day:2007-03-22
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