Invention Grant
- Patent Title: Heat dissipation device
- Patent Title (中): 散热装置
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Application No.: US11308704Application Date: 2006-04-24
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Publication No.: US07654309B2Publication Date: 2010-02-02
- Inventor: Yi-Qiang Wu , Chun-Chi Chen
- Applicant: Yi-Qiang Wu , Chun-Chi Chen
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200510037284 20050912
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat dissipation device includes a heat sink (10), a fan (20) disposed on top of the heat sink, a fan duct (30) arranged on the fan and a fan guard (40) sandwiched between the fan and the fan duct. The fan defines a through hole (26) at each corner and includes a plurality of positioning blocks (28) extending from each side edge thereof. The fan duct includes a plurality of connecting portions (32) extending from a circumference of the fan duct near the fan. Each connecting portion includes a post fitted in the through hole and a hook engaging with the positioning block.
Public/Granted literature
- US20070058342A1 HEAT DISSIPATION DEVICE Public/Granted day:2007-03-15
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