Invention Grant
- Patent Title: Semiconductor laser diode and the manufacturing method thereof
- Patent Title (中): 半导体激光二极管及其制造方法
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Application No.: US12153681Application Date: 2008-05-22
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Publication No.: US07653114B2Publication Date: 2010-01-26
- Inventor: Yutaka Inoue , Yasuhisa Semba , Susumu Sorimachi , Kouichi Kouzu
- Applicant: Yutaka Inoue , Yasuhisa Semba , Susumu Sorimachi , Kouichi Kouzu
- Applicant Address: JP Kanagawa
- Assignee: Opnext Japan, Inc.
- Current Assignee: Opnext Japan, Inc.
- Current Assignee Address: JP Kanagawa
- Agency: Stites & Harbison PLLC
- Agent Juan Carlos A. Marquez, Esq.
- Priority: JP2007-138621 20070525
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S3/097 ; H01L21/00

Abstract:
A multibeam semiconductor laser diode having: an n-type semiconductor substrate; an n-type clad layer, an active layer, a p-type clad layer and a contact layer; a plurality of partitioning grooves extending from one end to the other end of the substrate and formed from the contact layer to a predetermined depth of the p-type clad layer; a stripe-shaped ridge sandwiched between two separation grooves; an insulating layer covering an area from each side wall of the contact layer of each ridge to an end of the partitioning region via the separation groove; a first electrode formed on a second plane of the substrate; and a second electrode formed in each partitioning region covering an area above the ridge, separation grooves and multilayer semiconductor layers outside the separation grooves, the second electrode being constituted of a lower second electrode layer and an upper second plated layer.
Public/Granted literature
- US20080291960A1 Semiconductor laser diode and the manufacturing method thereof Public/Granted day:2008-11-27
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