Invention Grant
- Patent Title: Embedding memory within tile arrangement of an integrated circuit
- Patent Title (中): 在集成电路的瓦片布置中嵌入存储器
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Application No.: US11926092Application Date: 2007-10-28
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Publication No.: US07652499B2Publication Date: 2010-01-26
- Inventor: Herman Schmit , Jason Redgrave
- Applicant: Herman Schmit , Jason Redgrave
- Applicant Address: US CA Santa Clara
- Assignee: Tabula, Inc.
- Current Assignee: Tabula, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Adeli & Tollen LLP
- Main IPC: H03K19/177
- IPC: H03K19/177

Abstract:
Some embodiments of the invention provide a configurable IC that includes several configurable computational tiles and several memory tiles. Each computational tile has a set of configurable logic circuits for configurably performing a plurality of computations and a set of configurable routing circuits. The routing circuits of the tiles configurably route signals between configurable logic circuits. Each memory tiles includes a set of routing circuits and a memory array for storing data on which the logic circuit perform computation. In this IC, at least a first memory tile has the same set of configurable routing circuits as at least a second computational tile.
Public/Granted literature
- US20080116931A1 Embedding Memory within Tile Arrangement of a Configurable IC Public/Granted day:2008-05-22
Information query
IPC分类: