Invention Grant
- Patent Title: Microfluidic cooling of integrated circuits
- Patent Title (中): 集成电路的微流体冷却
-
Application No.: US11103216Application Date: 2005-04-11
-
Publication No.: US07652372B2Publication Date: 2010-01-26
- Inventor: Terry J. Dishongh , Jason T. Cassezza , Kevin S. Rhodes
- Applicant: Terry J. Dishongh , Jason T. Cassezza , Kevin S. Rhodes
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/10

Abstract:
A microchannel cooling system used to cool integrated circuits may include a number of microchannels which may be subject to bubble blockage. When bubble formation or nucleation occurs due to heating, the bubbles may become trapped within the microchannels. A valve within the microchannel may automatically operate, at least partially, to close off the microchannel, allowing the bubble to be freed and to be flushed from the channel in some embodiments.
Public/Granted literature
- US20060227512A1 Microfluidic cooling of integrated circuits Public/Granted day:2006-10-12
Information query
IPC分类: