Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US11461598Application Date: 2006-08-01
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Publication No.: US07652350B2Publication Date: 2010-01-26
- Inventor: Kazunari Hatade
- Applicant: Kazunari Hatade
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-022721 20060131
- Main IPC: H01L29/745
- IPC: H01L29/745

Abstract:
A semiconductor device including a horizontal unit semiconductor element, the horizontal unit semiconductor element including: a) a semiconductor substrate of a first conductivity type; b) a semiconductor region of a second conductivity type formed on the semiconductor substrate; c) a collector layer of the first conductivity type formed within the semiconductor region; d) a base layer of the first conductivity type having an endless shape and formed within the semiconductor region such that the base layer is off the collector layer but surrounds the collector layer; and e) a first emitter layer of the second conductivity type formed in the base layer, the horizontal unit semiconductor element controlling, within a channel region formed in the base layer, movement of carriers between the first emitter layer and the collector layer, wherein the first emitter layer is formed by plural unit emitter layers which are formed along the base layer.
Public/Granted literature
- US20070176205A1 SEMICONDUCTOR DEVICE Public/Granted day:2007-08-02
Information query
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