Invention Grant
- Patent Title: Apparatus for the removal of an edge polymer from a substrate and methods therefor
- Patent Title (中): 用于从衬底去除边缘聚合物的设备及其方法
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Application No.: US11236170Application Date: 2005-09-26
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Publication No.: US07651585B2Publication Date: 2010-01-26
- Inventor: Hyungsuk Alexander Yoon , Yunsang Kim , Jason A. Ryder , Andrew D. Bailey, III
- Applicant: Hyungsuk Alexander Yoon , Yunsang Kim , Jason A. Ryder , Andrew D. Bailey, III
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: IP Strategy Group, P.C.
- Main IPC: C23F1/00
- IPC: C23F1/00 ; H01L21/306 ; C23C16/00

Abstract:
An apparatus generating a plasma for removing an edge polymer from a substrate is disclosed. The embodiment includes a powered electrode assembly, including a powered electrode, a first dielectric layer, and a first wire mesh disposed between the powered electrode and the first dielectric layer. The embodiment also includes a grounded electrode assembly disposed opposite the powered electrode assembly so as to form a cavity wherein the plasma is generated, the first wire mesh being shielded from the plasma by the first dielectric layer when the plasma is present in the cavity, the cavity having an outlet at one end for providing the plasma to remove the edge polymer.
Public/Granted literature
- US20070068899A1 Apparatus for the removal of an edge polymer from a substrate and methods therefor Public/Granted day:2007-03-29
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