Invention Grant
- Patent Title: Method and system for problem case packaging
- Patent Title (中): 问题包装的方法和系统
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Application No.: US10839426Application Date: 2004-05-05
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Publication No.: US07647132B2Publication Date: 2010-01-12
- Inventor: Wen-Chang Kuo , Chien-Chung Huang , Tien-Der Chiang , Yi-Lin Huang , Chun Yi Chen , Dan-Ru Wang
- Applicant: Wen-Chang Kuo , Chien-Chung Huang , Tien-Der Chiang , Yi-Lin Huang , Chun Yi Chen , Dan-Ru Wang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes And Boone, LLP
- Main IPC: G06F19/00
- IPC: G06F19/00
Abstract:
A method of problem case packaging handling consists collecting manufacturing problem information from entities associated with fabrication of a semiconductor product; and distributing the manufacturing problem information into problem cases which are stored in a problem database, each problem case representing a respective manufacturing problem and being associated with manufacturing problem information related to that problem case.
Public/Granted literature
- US20050251277A1 Method and system for problem case packaging Public/Granted day:2005-11-10
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