Invention Grant
- Patent Title: Methods and apparatus for reconstructing thick image slices
- Patent Title (中): 用于重建厚图像切片的方法和装置
-
Application No.: US11233670Application Date: 2005-09-23
-
Publication No.: US07646842B2Publication Date: 2010-01-12
- Inventor: Jiang Hsieh , Xiangyang Tang
- Applicant: Jiang Hsieh , Xiangyang Tang
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Armstrong Teasdale LLP
- Main IPC: A61B6/00
- IPC: A61B6/00

Abstract:
A method for obtaining data includes scanning an object using a CT imaging system having at least two detector rows to acquire projection data, wherein the projection data includes at least some data obtained from at least two rows of the detector array, and reconstructing data representative an image of the object utilizing the projection data wherein the reconstruction includes pipelining the acquired projection data through a pipeline of operations including column-filtering, tomographic filtering, and backprojection. Thick reconstructed images using 3D backprojection can be obtained with significantly lessened artifacts relative to conventional 3D backprojection image reconstructions.
Public/Granted literature
- US20070071159A1 Methods and apparatus for reconstructing thick image slices Public/Granted day:2007-03-29
Information query