Invention Grant
- Patent Title: Multilayer capacitor and method of manufacturing same
- Patent Title (中): 多层电容器及其制造方法
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Application No.: US11710401Application Date: 2007-02-26
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Publication No.: US07646586B2Publication Date: 2010-01-12
- Inventor: Masaaki Togashi
- Applicant: Masaaki Togashi
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JPP2006-055347 20060301
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G9/00

Abstract:
A multilayer capacitor comprises a multilayer body in which a plurality of dielectric layers and a plurality of first and second inner electrodes are laminated alternately, and first and second terminal electrodes arranged on the multilayer body. The first terminal electrode is electrically connected to the first inner electrodes. The first terminal electrode includes one or a plurality of resistance layers having a resistivity greater than that of the first inner electrode. The one or a plurality of resistance layers cover end portions of lead portions of the first inner electrodes exposed at the side face. Each resistance layer has a width wider than the lead portion of the first inner electrode but narrower than the width of the side face formed with the first terminal electrode.
Public/Granted literature
- US20070205514A1 Multilayer capacitor and method of manufacturing same Public/Granted day:2007-09-06
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