A micro-electromechanical device includes a semiconductor body, in which at least one first microstructure and one second microstructure of reference are integrated. The first microstructure and the second microstructure are arranged in the body so as to undergo equal strains as a result of thermal expansions of the body. Furthermore, the first microstructure is provided with movable parts and fixed parts with respect to the body, while the second microstructure has a shape that is substantially symmetrical to the first microstructure but is fixed with respect to the body. By subtracting the changes in electrical characteristics of the second microstructure from those of the first, variations in electrical characteristics of the first microstructure caused by thermal expansion can be compensated for.