Invention Grant
US07646477B2 Method and apparatus for inspecting a pattern formed on a substrate
失效
用于检查在基板上形成的图案的方法和装置
- Patent Title: Method and apparatus for inspecting a pattern formed on a substrate
- Patent Title (中): 用于检查在基板上形成的图案的方法和装置
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Application No.: US11131379Application Date: 2005-05-18
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Publication No.: US07646477B2Publication Date: 2010-01-12
- Inventor: Minoru Yoshida , Shunji Maeda , Atsushi Shimoda , Kaoru Sakai , Takafumi Okabe , Masahiro Watanabe
- Applicant: Minoru Yoshida , Shunji Maeda , Atsushi Shimoda , Kaoru Sakai , Takafumi Okabe , Masahiro Watanabe
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2001-277681 20010913; JP2002-267554 20020913
- Main IPC: G01N21/00
- IPC: G01N21/00

Abstract:
A pattern inspection apparatus includes a light source which emits ultraviolet light, an irradiator which reduces coherency of the ultraviolet light and irradiates the coherency reduced ultraviolet light onto a specimen on which a pattern is formed through an objective lens, and a focus control means which projects light on the specimen from outside the objective lens, detects light reflected from the specimen by the projection and adjusts a height of the specimen relative to the objective lens. The apparatus further includes an image which forms an image of the specimen irradiated with the ultraviolet light and detects the formed image with a sensor, an image processor which processes a signal outputted from the sensor to detect a defect of the specimen, and a display which displays information of the defect detected by the image processor.
Public/Granted literature
- US20050206888A1 Method and apparatus for inspecting a pattern formed on a substrate Public/Granted day:2005-09-22
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