Invention Grant
- Patent Title: Grounded self-complementary antenna for electronic device
- Patent Title (中): 电子设备接地自补偿天线
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Application No.: US11802096Application Date: 2007-05-18
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Publication No.: US07646348B2Publication Date: 2010-01-12
- Inventor: Jiunn-Ming Huang , Chia-Tien Li , Shen-Pin Wei , Kuan-Hsueh Tseng
- Applicant: Jiunn-Ming Huang , Chia-Tien Li , Shen-Pin Wei , Kuan-Hsueh Tseng
- Applicant Address: TW Taipei Hsien
- Assignee: Winstron Neweb Corporation
- Current Assignee: Winstron Neweb Corporation
- Current Assignee Address: TW Taipei Hsien
- Priority: TW95119922A 20060605
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/48

Abstract:
A metal complementary element of a grounded self-complementary antenna for an electronic device and a metal grounding element of the electronic device contact with each other, are electrically connected to each other or are a same article so as to substantially enlarge an area of a grounding end of the self-complementary antenna to enable the self-complementary antenna to have the good radiation efficiency and the broader bandwidth such that the radio signal transmission effect of the electronic device can be elevated.
Public/Granted literature
- US20080088522A1 Grounded self-complementary antenna for electronic device Public/Granted day:2008-04-17
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