Invention Grant
- Patent Title: Wafer-scale phased array
- Patent Title (中): 晶圆级相控阵
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Application No.: US12045377Application Date: 2008-03-10
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Publication No.: US07646344B2Publication Date: 2010-01-12
- Inventor: Duixian Liu
- Applicant: Duixian Liu
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Anne V. Dougherty
- Main IPC: H01Q1/38
- IPC: H01Q1/38
Abstract:
An antenna array includes at least a first and a second substrate; a plurality of radiators located proximate to a surface of the first substrate opposite the second substrate; at least a first ground plane located between the first and the second substrate, the ground plane having a plurality of slots located therein; and a plurality of feed lines located proximate to a surface of the second substrate opposite the first substrate.
Public/Granted literature
- US20090015483A1 Wafer-Scale Phased Array Public/Granted day:2009-01-15
Information query
