Invention Grant
US07646212B2 Memory system including a power divider on a multi module memory bus
有权
存储系统包括多模块存储器总线上的功率分配器
- Patent Title: Memory system including a power divider on a multi module memory bus
- Patent Title (中): 存储系统包括多模块存储器总线上的功率分配器
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Application No.: US11668397Application Date: 2007-01-29
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Publication No.: US07646212B2Publication Date: 2010-01-12
- Inventor: Myung-Hee Sung , Jin-Gook Kim , Joung-Ho Kim , Jong-Hoon Kim
- Applicant: Myung-Hee Sung , Jin-Gook Kim , Joung-Ho Kim , Jong-Hoon Kim
- Applicant Address: KR Gyeonggi-do KR Daejeon
- Assignee: Samsung Electronic Co., Ltd.,Korea Advanced Institute of Science and Technology (KAIST)
- Current Assignee: Samsung Electronic Co., Ltd.,Korea Advanced Institute of Science and Technology (KAIST)
- Current Assignee Address: KR Gyeonggi-do KR Daejeon
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR2006-10384 20060203
- Main IPC: H03K19/003
- IPC: H03K19/003

Abstract:
A memory system includes a memory controller, a transmission bus, a power divider, a first memory chip, and a second memory chip. The transmission bus is coupled from the memory controller to a first node of the power divider for transferring signals. The first node of the power divider is coupled to a second node of the power divider via a first line, and the first node is also coupled to a third node of the power divider via a second line. The first memory chip is coupled to the second node via a first branch bus and the second memory chip is coupled to the third node via a second branch bus. Accordingly, reflected wave due to an impedance mismatching can be reduced to enhance the signal integrity.
Public/Granted literature
- US20070194968A1 MEMORY SYSTEM INCLUDING A POWER DIVIDER ON A MULTI MODULE MEMORY BUS Public/Granted day:2007-08-23
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